tech

The dual-tower god-level heat dissipation with high performance and low price ra

A few days ago, I tested the RZ400 V2 cooler from Super Flower, and there have been quite a few inquiries about the performance version V2 of the Coolio Yitian P60T cooler. So, I went ahead and purchased one from JD for a substantial amount to test it out.

Honestly, though, what were you guys thinking, comparing a single-tower, four-heat-pipe, single-fan cooler to a dual-tower, six-heat-pipe, dual-fan cooler? It's clearly not a fair comparison.

Let's start with a brief introduction: Coolio's parent company is Golden Leopard, which mainly focuses on server cooling. It's a very large manufacturer, but Coolio itself doesn't have a strong marketing presence. It's essentially word-of-mouth, and the product's quality is quite good, with a very high cost-performance ratio, which is why it has become popular. Looking at the official website, it seems like they manufacture a lot of products for others.

The product was purchased from a third-party seller on JD, not from JD's own inventory, for a price of 266 yuan. It comes with an anti-bend CPU retention bracket, and the price on Taobao is similar. I chose the black version, which is a bit more expensive. In addition to that, there is also a silver "metal original" version and a white version.

The overall packaging of the P60T gives me a very be quiet! or Noctua design vibe, with corrugated cardboard and simple printing, very industrial.

The product itself, due to its dual-tower design, is relatively large compared to the packaging. The front shows the appearance of the product, with three English terms on the left side corresponding to ball bearings, reflow soldering, and copper base, which are also the three main selling points of the product. Below that is the product model Etian P60T, which corresponds to "Yitian" – I wonder if foreigners can understand that.

On one side of the packaging is the product's dimensions and a QR code for the sales and marketing channels, while the other side lists the specifications of the two fans. It's interesting to note that the P60T comes with two different fans, which I will introduce separately later.

The cooler itself consists of two symmetrical single-tower coolers, with the left and right layout being identical – no need to distinguish between left and right for installation. There's no design to avoid memory obstruction, but the heat sink fins are relatively narrow, so it essentially avoids obstructing the memory.

The base uses a copper-plated nickel solution, and the entire thing has been treated with reflow soldering. The version I purchased is the black one, so it has also undergone a blackening process – the material doesn't seem to be graphene. The heat pipes are six 6mm ones.The presence of holes on the fins confirms the use of reflow soldering technology. In addition to this, there is also a FIN lock treatment, and the edges and corners of the fins have been processed to prevent them from easily causing hand injuries [of course, we all believe that great force can work miracles].

However, speaking of which, I have never been a big advocate for six-heat-pipe coolers. After all, the heat-generating area of the CPU core is just a small part in the middle. Intel's recent generations of CPUs are somewhat better, with a larger DIE length, which means a relatively larger contact area with the IHS (Integrated Heat Spreader).

For six-heat-pipe coolers, the two heat pipes at the edges have minimal effect, and only four heat pipes directly contact the core heat-generating area. The return on investment for a six-heat-pipe cooler is lower than that for a four-heat-pipe cooler. In fact, many six- or seven-heat-pipe coolers will not change their cooling performance even if the side heat pipes are cut off, so there is no need to spend extra money for more heat pipes. [For details, you can check the test on Bilibili with the ID 51972].

Another point is the issue of copper base and direct touch of heat pipes, which is also more efficient with direct touch of heat pipes [under the same level of craftsmanship]. The thermal conductivity of the copper block and heat pipes is incomparable, with an order of magnitude difference. A few years ago, due to substandard direct touch craftsmanship, the copper base was more efficient. Currently, there are basically no craftsmanship issues, so there is no need to pay much attention to the base craftsmanship.

As an extension, let's talk about another product, the 3DVC series from Cooler Master. I bought a second-hand MasterAir Maker 8 3DVC from the previous generation, but I don't know where the clips are, and they are not very compatible with the regular Cooler Master air cooler clips... Now it's just gathering dust.

In 2024, there will be a new cooler in this product line. I will consider whether to tinker with it when the time comes. There is already news out, but I don't know when it will go on sale. For such innovative products that require a lot of tinkering, I am willing to pay regardless of whether they are practical or not.

Cooler Master's product line is very interesting. It uses a vapor chamber as a large plane to fully contact the CPU IHS, eliminating the temperature difference between the core heat-generating area and the surroundings. Then, it uses internally connected heat pipes or soldered heat pipes to complete the vertical heat conduction. In essence, the overall cooling is entirely the thermal efficiency of the heat pipes and the VC vapor chamber. Because of the presence of the vapor chamber, the efficiency of each heat pipe is very high.

In essence, the 3DVC product line is designed to solve the contact efficiency problem between the CPU and the cooler, by directly welding the VC vapor chamber and heat pipes together [internally connected]. There is also reflow soldering between the heat pipes and the fins, so the entire cooler is basically a single entity. It is basically the most efficient solution except for direct contact with the bare DIE, and the theoretical thermal efficiency between the vapor chamber and the heat pipes is maximized.

However, in practice, I did not feel any qualitative change in this product. The improvement in cooling effect is limited. This product series is still a niche product, and sales = effect. I might not mention it, and many people might not know about this series, so everyone should have an idea, what kind of craftsmanship ≠ final effect.Back to the topic of the Yi Tian P60T, it's not common to see two sizes of fans paired together. One is a standard 12CM fan, positioned as a pressure fan, with the model number T28-B15. It has two speed options, with the standard speed reaching up to 2150 RPM and the performance speed reaching up to 2550 RPM. The mode can be selected via a toggle switch, and the test is conducted at the default speed of 2150 RPM.

The other fan is a 13CM fan, designed as an airflow fan, with the model number C130-B15. It operates at a lower speed of only 1600 RPM. Both fans feature a metal core design, with the 13CM fan serving as the primary fan and the 12CM fan as the secondary fan. The smaller size also helps to avoid interference with the motherboard's MOS heatsinks or memory modules.

The mounting hardware provided includes recent standards such as Intel 115X/1200/1700 and AMD AM4/AM5 brackets, along with a small tube of thermal paste.

The screws are arranged from top to bottom as AM4/AM5, 115X, 1700, and universal screws for Intel brackets. The screws are individually packaged, which is not as convenient as a small zip-lock bag.

The overall design is a bulky dual-tower heatsink with an aluminum decorative cover on top. The color options include white, black, and the original metal color, with the latter being my personal preference, although I ended up buying black... There is also an option for a white theme build.

The airflow fan can be installed at the bottom, which adds about 1CM, and some of the airflow can provide additional cooling to the lower areas near the CPU.

For testing, the same platform as last time was used, with the I9 13900K as the load. The ambient temperature was still around 22 degrees Celsius, and the humidity increased to 70%.

The thermal paste used was the one included with the cooler. The amount of thermal paste in the photo was slightly excessive, affecting the test results by about 6-7 degrees higher. The test results below are after reducing the amount of thermal paste by half.

In terms of memory compatibility, I tested the DRAM Eclipse and the RGB Trident memory modules, and there were no conflicts. However, with the dual-fan setup, the memory will definitely be blocked, with almost no part of it visible.First, the dual-fan scenario was tested with "12CM fans in default mode, fan speed based on 12CM specifications". The idle temperature was around 32 degrees Celsius, with fan speeds around 780 RPM.

During dual-fan single-burn FPU testing, power consumption stabilized at around 253W, CPU temperature reached 76 degrees Celsius, P-core temperatures ranged between 82 to 87 degrees Celsius, and E-core temperatures were between 76 to 79 degrees Celsius, with fan speeds around 2100 RPM.

Next, with a single fan installed, the fan was positioned between the dual towers, using a single 130 CFM fan. The CPU temperature was 82 degrees Celsius, P-core temperatures ranged between 86 to 93 degrees Celsius, and E-core temperatures were between 81 to 86 degrees Celsius, with fan speeds around 1700 RPM.

The idle temperature was 36 degrees Celsius, with fan speeds at 813 RPM. Considering the duration of the test, all tests were single-burn FPU for 15 minutes.

With a single 120 CFM fan in default mode, the CPU temperature was 81 degrees Celsius, P-core temperatures ranged between 84 to 92 degrees Celsius, and E-core temperatures were between 81 to 85 degrees Celsius, with fan speeds around 2100 RPM.

The idle temperature with a single 120 fan was around 40 degrees Celsius, with fan speeds around 843 RPM.

In performance mode with a single 120 fan, the CPU temperature was 76 degrees Celsius, P-core temperatures ranged between 82 to 87 degrees Celsius, and E-core temperatures were between 76 to 80 degrees Celsius, with fan speeds around 2700 RPM.

The idle temperature was around 31 degrees Celsius, with fan speeds around 1000 RPM, which is significantly more aggressive compared to the default mode, with frequent acceleration.

In terms of noise, the ambient noise was around 34 decibels, which was not very noticeable during idle conditions. The loudest noise was when the single pressure fan was in performance mode, reaching 48 decibels, while in default mode it was around 41 decibels, and with dual fans it was around 43 decibels. Overall, the noise was acceptable as long as performance mode was not activated.

Additionally, when the pressure fan was in performance mode, the speed adjustment was quite aggressive, with sudden increases in speed, making the noise quite noticeable. Noise measurements were taken at a distance of approximately 0.8 meters from the heatsink.In the final summary, first of all, when compared with the Super Flower RZ400 V2, the Yitian wins quite decisively. The larger thermal scale is an overwhelming advantage that cannot be surpassed.

Overall, the performance of the Coolio Yitian P60T is very impressive. The one large and one small fan ensure adequate airflow and pressure by default, while also taking into account low noise levels. For those who need high pressure, there is also a performance mode available. In general, the cost-performance ratio is quite good, and the price is also quite affordable. According to my personal preference, I would usually recommend installing just one 130mm airflow fan. A slightly higher temperature is not a big issue, but excessive noise can be unbearable.